Epoxy Resin

The range of epoxy resins are divided into five main groups

The Standard Filled Systems which are used for general purpose potting and encapsulation.

The Thermally Conductive Materials employ innovative technology that allows us to produce materials with high thermal conductivity but a relatively low mix viscosity.

The Unfilled Resins differ in processing properties (such as cure times or viscosities) and also in cured properties, for instance, low dielectric loss, high dielectric strength, good chemical and temperature resistance. They can be hard or tough and flexible.

Our One Component Adhesives are heat activated with modified properties and are usually used as adhesives in automotive applications where the excellent chemical and heat resistance is exploited.

Specialist Bespoke Products are now offered for general usage. They include a ?security? invasion preventing resin system, a general purpose flexible encapsulation system and a low viscosity chemically resistant resin for sensors