Bonding

Products that are specifically designed and formulated for Bonding.

2 Item(s)

per page

  • EP5941

    ALCHEMIX EP 5941 is an unfilled, low viscosity, epoxy resin system formulated for adhesion of large planks of modelboard. A choice of hardeners is available, giving extremely short curing times (H5941F) or long working time (H5941). ALCHEMIX EP 5941 is specifically formulated for high temperature applications Learn More
  • MG301

    ALCHEMIX MG 301 is a lightweight paste made with specific low density fillers. When mixed with the part B it has excellent flow characteristics. It has a high reactivity and is fast curing. Used for the adhesion of large planks of modelboard M301. A slow version, Model Board Adhesive ALCHEMIX MG 301S is also available. Learn More

2 Item(s)

per page